February 16th, 2009: j360 Silicon PathFinder™ 3D Platform Supports 3D Supports Stacked IC Design using Through Silicon Vias (TSV), with ThreeDimensional Floorplanning Capabilities and up Ten Tiers of Silicon
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Javelin Design Automation Unveils j360™ With TrueFit™, TruePlan™ And TruePro™
June 30th, 2008: The First Specification-Driven Floorplanning And Prototyping Platform For Early Design Feasibility And Superior QoR. J360 enables Business Users, Architects, RTL Designers And Chip Integrators To Quickly Develop Complex, High-Performance, Low-Power SoC Designs In Parallel.The First Specification-Driven Floorplanning And Prototyping Platform For Early Design Feasibility And Superior QoR.